Read the article and do the tasks

     Removing components

First, double-check that you have disconnected the power source.Then, clear the solder from the hole using a soldering iron and
solder wick. Heat the solder. The molten solder will flow into the wick. Then you can pull the lead through. For large pieces, suck the solder away using a solder sucker. This may leave a coating of solder. Remove this using wick.
     Some parts of the circuit are made of copper, which absorbs heat. Thermal absorption makes it hard to melt solder. The thick, multi-layered boards also produce a heat-sinking effect. If you can't
melt the solder, don't use a higher wattage iron. This can deform the boards and damage the circuit lands. It can also delaminate
multi-layered circuit board lands and some components' pads. If you can't remove all the solder, clip the leads close to the components. Then you can solder the new component to the old
component's leads. If you can't reach the leads, chop off the component close to its base.

1. Read the article on removing components. Then, mark the following statements as true (T) or false (F).
1 _ Solder wick is used to remove small pieces of solder.
2 _ A higher wattage iron is good to use on multi-layered boards.
3 _ Remove the solder before cutting the component leads.

2. Match the words (1-8) with the definitions (A-H).

1 _ flow 

2 _ deform 

3 _ delaminate 

4 _ chop off

5 _ suck

6 _ double-check

7 _ clear

8 _ clip

A check something twice
B remove obstacles from a passage
C remove the coating
D cut through something small and thin
E remove using a vacuum
F move in liquid form
G change shape in a bad way
H cut and remove something

3. Write a word that is similar in meaning to the underlined part.

1. These days most circuit boards are made of several boards on top of each other.

m _ _ _ _ -_a _ _ r _ _.
2. The fact that some parts take away the heat often makes it hard to melt solder.

_h _ _ _ _ l    _b _ _ _ _ _ i _ _.
3. The thickness of the boards creates a fastcooling effect.

h _ _ _ - _ _ n _ _ _ g.
4. You can remove the lead once the solder is hot and in liquid form.

_ _ I _ _n.
5. You don't need to add a thick layer of paint. A thin layer is enough.

_ 0 _ _ _ n _.